PRODUCTS |
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Tech Roadmap |
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Item |
Current |
2013 |
2014 |
Max. Layer |
48 |
36 |
40 |
Track width/space |
inner£¨mil£© |
2 / 2 |
3 / 3 |
2.5/ 2.5 |
outer£¨mil£© |
2 / 2 |
4 / 3 |
3 / 3 |
Aspect Ratio |
16 : 1 |
14 : 1 |
15 : 1 |
Copper Weight (oz) |
12 |
8 |
10 |
Impedance tolerance |
¡À5% |
¡À8% |
¡À5% |
Material |
Microwave material |
SV |
SV |
SV |
Via in pad |
SV |
SV |
SV |
Lead-free |
MP |
MP |
MP |
Mix lamination |
SV |
P |
SV |
Metal Based/Core |
SV |
P |
SV |
HiTg |
MP |
MP |
MP |
HDI |
4+N+4 |
SV |
/ |
P |
Buried resistance/electric capacity |
SV |
/ |
P |
P: Prototype SV: Small Volume MP: Mass Production |
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